Of primary importance to Lightstream Photonics' technology is the marriage of high power LEDs and heat pipe technology which allows for ultra-high power density packaging. The ultra-high thermal conductivity of the heat pipe (effectively 1000x that of copper) allows for over-driving the LEDs by a factor of 4x, while maintaining junction temperatures well within rated limits. Other attributes include low thermal resistance submount, brightness-maintaining TIR reflector, low cross-sectional area heat sink, and individually addressable high-density chip array. These attributes facilitate the ability to achieve high power densities, even without integral heat pipes, which is especially useful for those applications that do not demand ultra-high thermal performance

As LED products become more sophisticated, eliminating internal heat build-up has also become increasingly difficult. Devices are becoming more powerful and creating solutions for removing the resulting heat generation often pose great challenges for designers and engineers. Lightstream Photonics has developed an LED packaging technology that utilizes Micro Heat Pipes (MHP's) which greatly surpass the performance of conventional cooling technologies, and benefit high-density, miniaturized LED components.

Features

Lightstream Photonics employs MHP's in unique packaging configurations that make much higher output LED devices practical. The key to Lightstream Photonics' benefits lie in the bonding of the LED device to the MHP component in such a manner to minimize the physical space requirements while taking advantage of MHP's unique rapid heat dissipation capabilities. This allows much more closely spaced LEDs operating at higher power and brightness than ever achieved previously.

The key components in Lightstream Photonics' products are the next generation LED chips, novel integration of packaging materials and methodologies, MHPs, and the elliptical or parabolic Total Internal Reflection (TIR) reflectors. Our unique end-mounting techniques of the LED component to the heat pipe structure maximizes thermal conductivity in the direction substantially opposite to the light output, which in turn minimizes real estate consumption.